HV Process and Layout-new

no4ing · 发表于 2009-5-31 16:16:32

感谢楼主分享~~

keer_lily · 发表于 2009-8-10 09:25:42

谢谢楼主分享

huacc121 · 发表于 2009-8-10 12:11:27

感謝分享~ Thanks a lot for kindly sharing

zlh95222 · 发表于 2009-8-10 19:46:21

好东西自然要顶1

zlh95222 · 发表于 2009-8-10 19:49:39

目前正在学习，谢了！

fan2009 · 发表于 2009-9-27 17:32:56

好东西一定要顶

fan2009 · 发表于 2009-9-27 17:34:16

Louie999 · 发表于 2009-9-28 09:22:56

18BGBGBGBGBG

Louie999 · 发表于 2009-9-28 09:25:00

bgbgbgbgbg18

suk.qi · 发表于 2009-9-28 09:43:35

For HV Product Mismatch Improvement
–LayoutDesign Dominate the Mismatch
–LV Device is better than HV Device
–HighMask Grade Better than Low Mask Grade
–Somekey process stage have effect on Mismatch

For High Leakage Issue Improvement of HV Product
–Latch-Up issue need to take care
–Isolation Layer is a plus for HV DeviceConclusion

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HV Process and Layout-new

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