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本帖最后由 2046 于 2022-11-30 22:22 编辑
With the development of new multilevel packages, sophisticated application circuits, and ever-shrinking integrated circuit feature sizes, identifying the root cause of a failure is becoming more challenging. Failure analysis support is needed through the product life cycle, from technology development, design debug, fabrication, packaging, and reliability qualification, to production failures and customer returns. Identifying root cause requires knowledge of advanced failure analysis tools and newly developed techniques as well as strategic planning to determine which method to use and when. To continue to succeed, an analyst’s skills and knowledge must continue to grow as the defects and features we investigate relentlessly shrink. The Seventh Edition of the Microelectronics Failure Analysis Desk Reference can help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Written by a team of experts, this updated handbook offers the latest information on advanced failure analysis tools and techniques, buttressed with numerous reallife examples. Relevant and widely used articles on classic techniques have also been updated to include recent developments.
TRUE PDF, so many pics, TOO BIG.
Microelectronics Failure Analysis Desk Reference, 7th Edition @2019.pdf.zip.003.zip
(28.61 MB , 下载次数:
283 )
Microelectronics Failure Analysis Desk Reference, 7th Edition @2019.pdf.zip.004.zip
(11.89 MB , 下载次数:
291 )
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