3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility pdf

ab3028 · 发表于 2018-4-11 19:21:17

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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G MobilityLih-Tyng Hwang and Jason Tzyy-Sh Horng, "3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility" English | ISBN: 1119289645 | 2018 | 440 pages | PDF | 11 MB
An interdisciplinary guide to technologies and technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

Features an technologies and hardware for 3D ICs and 5G mobility
Presents , such as Microsoft's Excel and Minitab
Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
Provides chapter-wise review questions and powerpoint slides as teaching tools

3D IC and RF SiPs.pdf (11.49 MB , 下载次数: 682 )

lhyi · 发表于 2018-4-12 02:18:48

Thanks

apteye · 发表于 2018-4-12 10:29:53

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dcircuit · 发表于 2018-4-12 20:20:50

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tu_yjq123 · 发表于 2018-4-12 22:36:34

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besarkecil · 发表于 2018-4-15 12:57:47

回复 1# ab3028

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bing113 · 发表于 2018-4-22 20:15:37

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cikulangsat · 发表于 2018-4-23 09:42:17

回复 1# ab3028

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KiddLo · 发表于 2018-4-23 10:05:05

Thanks for sharing.

ddale · 发表于 2018-4-24 17:52:03

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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility pdf

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