新书 Three Dimensional System Integration: IC Stacking Process and Design

fpga_sh · 发表于 2010-12-19 22:25:06

thank you very much

fpga_sh · 发表于 2010-12-19 22:27:35

thank you very much

fpga_sh · 发表于 2010-12-19 22:31:17

thank you very much

ningwei8027 · 发表于 2010-12-19 22:45:52

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mtwumtwu · 发表于 2010-12-20 09:24:36

good for sharing

zh123456789 · 发表于 2010-12-20 10:54:22

谢谢啊

lujunfeng111 · 发表于 2010-12-25 19:02:00

thanks for sharing~~~

lujunfeng111 · 发表于 2010-12-25 19:03:58

3D集成技术貌似还有很多关键技术需要解决。

nslnsl · 发表于 2011-1-3 13:14:52

多谢！！！！

tommychang · 发表于 2011-4-20 10:19:22

thanks for sharing

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[原创] 新书 Three Dimensional System Integration: IC Stacking Process and Design