先进封装好书推荐 Advances in Embedded and Fan-Out Wafer Level Packaging Technologies (IEEE Press)

abhom · 发表于 2024-9-3 08:22:56

感谢分享

wangyaobsz · 发表于 2024-10-21 14:41:28

thanks for sharing

jimcmwang · 发表于 2024-10-27 20:37:38

Advances in Embedded and Fan‐Out Wafer‐Level Packaging Technologies 2019.zip
(14.19 MB, 下载次数: 342 )

KINGLYWAY · 发表于 2024-11-29 15:00:35

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313949724 · 发表于 2024-12-9 22:43:21

谢谢

leon_strive · 发表于 2025-1-2 22:17:49

谢谢分享

penjpding · 发表于 2025-3-29 21:35:50

多谢多谢

wxp248664668 · 发表于 2025-3-31 13:05:22

厉害厉害！！！！

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[资料] 先进封装好书推荐 Advances in Embedded and Fan-Out Wafer Level Packaging Technologies (IEEE Press)